Materials required for FPC patch processing

1. Complete FPC board fabrication files (Gerber files, placement drawings, steel mesh files) and board fabrication requirements;

2. Complete BOM (including model, brand, package, description, etc.);

3. PCBA assembly drawing.

PS: To apply for PCBA functional testing fees, the PCBA functional testing method needs to be provided.

FPC patch processing process flow

1. Preprocessing;

2. Fixed;

3. Printing;

4. SMD (Surface Mounted Device) chip;

5. Reflow soldering;

6. Testing;

7. Inspection;

8. Board separation.

Precautions for FPC patch processing

1. FPC fixation: The entire process from printing and chip mounting to reflow soldering should be fixed on a carrier board, which requires a low thermal expansion coefficient.

2. Solder paste printing: Due to the presence of a high-temperature resistant tape for positioning on the FPC mounted on the carrier board, which causes the height to deviate from the plane of the carrier board, an elastic squeegee must be used during printing. The composition of the solder paste has a significant impact on the printing effect, so it is necessary to select the appropriate solder paste.

3. Mounting equipment: Firstly, it is best for the solder paste printer to be equipped with an optical positioning system, otherwise the soldering quality will be greatly affected. Secondly, the FPC is fixed on the carrier board, but there will always be some small gaps between the FPC and the carrier board, which is a significant difference from the PCB substrate. Therefore, the setting of equipment parameters will have a significant impact on the printing effect, mounting accuracy, and soldering effect.