One-stop PCBA solution service provider_Neo Industrial Group Co., Limited

Specializing in high-speed PCB design, as well as PCB manufacturing and PCBA production services for batch products!

neo@neo-industrialgroup.com

Equipment Center

X-ray marking machine: Ruimao XC-3100

Equipment Center

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Equipment capacity Spatial resolution (um): 100 Feeding speed: 7-14S/plate (CHIP0402) Accuracy: 99.99% (taking 0201 as an example) Imaging accuracy: 85um Imaging size: 430 * 430mm Resolution: 36LP/cm
Milling cutter type substrate cutting machine: JLOC330S

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Equipment capacity Number of workbenches, dual workstations Machinable PCB size (Max): L320 * W350mm Cutting accuracy: ± 0.05mm Positioning accuracy: ± 0.02mm Machinable PCB thickness: 0.5mm~4mm Spindle speed: Max6000RPM Machine repeatability accuracy: ± 0.02mm Moving speed: XY: 1500mm/Sec (Max) Z：700mm/Sec（Max)
Wave soldering equipment: JT MPS-350-II

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设备能力运输:         重型双钩爪传输；过板宽度：      50mm-450mm预热:         1.8米,2红外+1热风；喷雾:         步进马达控制,喷雾参数数值化控制锡槽:          特制铸铁防腐内胆波峰喷口:       直联式马达驱动，变频调速冷却:         强制自然风上下冷却 制程能力基板尺寸：50至450mm（W）120mm（H）入板高度：750±20mm波峰高度：Approx、12mm传输速度：500至1800mm/Min、传送角度：4至7o预热温度：Max、200℃锡炉温度：Max、300℃Equipment capacity Transportation: Heavy duty double hook and claw transmission; Width of the board: 50mm-450mm Preheating: 1.8 meters, 2 infrared+1 hot air; Spray: step motor control, spray parameter numerical control Tin bath: specially made cast iron anti-corrosion inner liner Wave crest nozzle: driven by direct motor, variable frequency speed regulation Cooling: Forced natural wind cooling up and down Process capability Substrate size: 50 to 450mm (W) 120mm (H) Entrance height: 750 ± 20mm Peak height: Approx, 12mm Transmission speed: 500 to 1800mm/min Transmission angle: 4 to 7 degrees Preheating temperature: Max, 200 ℃ Tin furnace temperature: Max, 300 ℃
BGA rework machine: ZM-R6200

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Equipment capacity ·Automatic welding and disassembly functions; ·Up and down hot air, bottom infrared, independent heating in three temperature zones, ·Temperature control accuracy: ± 3 ℃ ·Clamp size: Max 410 × 370 mm Min 65 × 65 mm; ·Strong cross flow fan at the bottom for rapid and reliable cooling; ·Repackable BGA size: Max 80 × 80mm Min 2 × 2mm; ·Minimum spacing 0.15mm, mounting accuracy 0.01mm ·Real time temperature curve display and analysis; ·The suction nozzle pressure can be controlled within a small range of 30 grams to 50 grams;
High resolution automatic optical inspection machine: HOLLY LX520IL-SE

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Equipment capacity PCB size: 50x50 mm -520x480 mm PCB thickness: 0.3mm~4mm PCB warpage:<3mm Part height: Top ≤ 25mm, Bottom ≤ 40mm Resolution: 13/16/19 μ m Process capability Accurate positioning<20 microns 0201LRC 0.3mm pitch QFP& μBGA 3-point-Comparison system
Tunnel type reflow soldering: HB CR-1002-N

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Equipment capacity Temperature control accuracy: ± 1 ℃ Horizontal cross plate temperature difference: ± 2.0 ℃ Temperature control range: 25-300 ℃ Process capability Corresponding board width: 50-400mm Support mesh belt transmission and chain transmission A wider process window is suitable for various curve requirements The height of the component passing through the board is Top30mm and Bottom 30mm Support nitrogen system
High precision SMT machine: Fuji NXT

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Equipment capability: H12s/H08 mounting head: ± 0.05mm (3 σ) CPK ≥ 1; H04 mounting head: ± 0.05mm (3 σ) CPK ≥ 1; H01 mounting head: ± 0.03mm (3 σ) CPK ≥ 1 Process capability: Can control the height of the components Scanning of coplanarity before BGA solder ball placement 01005RLC 0.3mm pitch QFP& μBGA Automatically skip the defective board judged by the previous station position and do not place any parts Readpaste mark Support FPCB/PSA/TSA components Component placement speed: 0.22sec/dot
Fully automatic high-precision printing machine: GKG

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Equipment capacity System alignment accuracy and repeatability accuracy: ± 12.5um@6 σ, CPK ≥2.0 Actual solder paste printing repeatability accuracy: ± 18um@6 σ, CPK ≥2.0 Printing cycle time ≤ 8.5 s Semi automatic steel mesh loading Ability to handle standard size boards: 450 x340mm ~ 50x50mm Process capability Process accuracy: ± 25 um ,CPK >2.0 @ 3 σ 0.3mm pitch QFP& μBGA 0.15mm PAD to PAD Steel mesh thickness 0.06~0.15 mm Single chip process technology Staircase printing

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Neo Industrial Group Co., Ltd. was established in 2022 and is a comprehensive PCBA manufacturer that integrates PCB manufacturing, component procurement, SMT (surface mount technology), DIP (plug-in), finished product assembly, and testing.

Email：neo@neo-industrialgroup.com

Add：7/F., Tower 1, Enterprise Square 1,9 Sheung Yuet Road , Kowloon Bay , Kowloon , Hong Kong

Neo Industrial Group Co., Limited