Equipment capacity
PCB size: 50x50 mm -520x480 mm
PCB thickness: 0.3mm~4mm
PCB warpage:<3mm
Part height: Top ≤ 25mm, Bottom ≤ 40mm
Resolution: 13/16/19 μ m
Process capability
Accurate positioning<20 microns
0201LRC
0.3mm pitch QFP& μBGA
3-point-Comparison system