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BGA industrial control motherboard assembly

BGA industrial control motherboard assembly

Name: BGA Industrial Control Motherboard Assembly


Number of SMT lines: 7 high-speed SMT surface mount supporting production lines


SMT daily production capacity: over 30 million points


Testing equipment: X-RAY tester, first piece tester, AOI automatic optical tester, ICT tester, BGA rework table

Mounting speed: Chip component mounting speed (optimal state) 0.036 S/piece

Minimum adhesive size: 0201, with an accuracy of ± 0.04mm


Minimum device accuracy: Can be used to mount PLCC, QFP, BGA, CSP and other devices, with a pin spacing of up to 0.04mm

IC type SMT accuracy: It has a high level of precision in mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. High difficulty products such as TFT display driver boards, mobile phone motherboards, battery protection circuits, etc. that can be mounted/inserted/mixed


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Name: BGA Industrial Control Motherboard Assembly


Number of SMT lines: 7 high-speed SMT surface mount supporting production lines


SMT daily production capacity: over 30 million points


Testing equipment: X-RAY tester, first piece tester, AOI automatic optical tester, ICT tester, BGA rework table

Mounting speed: Chip component mounting speed (optimal state) 0.036 S/piece

Minimum adhesive size: 0201, with an accuracy of ± 0.04mm


Minimum device accuracy: Can be used to mount PLCC, QFP, BGA, CSP and other devices, with a pin spacing of up to 0.04mm

IC type SMT accuracy: It has a high level of precision in mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. High difficulty products such as TFT display driver boards, mobile phone motherboards, battery protection circuits, etc. that can be mounted/inserted/mixed