Equipment capability:

H12s/H08 mounting head: ± 0.05mm (3 σ) CPK ≥ 1;

H04 mounting head: ± 0.05mm (3 σ) CPK ≥ 1;

H01 mounting head: ± 0.03mm (3 σ) CPK ≥ 1

Process capability:

Can control the height of the components

Scanning of coplanarity before BGA solder ball placement

01005RLC

0.3mm pitch QFP& μBGA

Automatically skip the defective board judged by the previous station position and do not place any parts

Readpaste mark

Support FPCB/PSA/TSA components

Component placement speed: 0.22sec/dot